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CD4014BMS, CD4021BMS
December 1992
CMOS 8-Stage Static Shift Registers
Description
CD4014BMS -Synchronous Parallel or Serial Input/Serial Output CD4021BMS -Asynchronous Parallel Input or Synchronous Serial Input/Serial Output CD4014BMS and CD4021BMS series types are 8-stage parallel- or serial-input/serial output registers having common CLOCK and PARALLEL/SERIAL CONTROL inputs, a single SERIAL data input, and individual parallel "JAM" inputs to each register stage. Each register stage is a D-type, master-slave flip-flop. In addition to an output from stage 8, "Q" outputs are also available from stages 6 and 7. Parallel as well as serial entry is made into the register synchronously with the positive clock line transition in the CD4014BMS. In the CD4021BMS serial entry is synchronous with the clock but parallel entry is asynchronous. In both types, entry is controlled by the PARALLEL/SERIAL CONTROL input. When the PARALLEL/SERIAL CONTROL input is low, data is serially shifted into the 8-stage register synchronously with the positive transition of the clock line. When the PARALLEL/ SERIAL CONTROL input is high, data is jammed into the 8stage register via the parallel input lines and synchronous with the positive transition of the clock line. In the CD4021BMS, the CLOCK input of the internal stage is "forced" when asynchronous parallel entry is made. Register expansion using multiple packages is permitted. The CD4014BMS and CD4021BMS are supplied in these 16 lead outline packages: Braze Seal DIP Frit Seal DIP Ceramic Flatpack H4T H1F H6W
Features
* High Voltage Types (20V Rating) * Medium Speed Operation 12MHz (Typ.) Clock Rate at VDD-VSS = 10V * Fully Static Operation * 8 Master-Slave Flip-Flops Plus Output Buffering and Control Gating * 100% Tested for Quiescent Current at 20V * Maximum Input Current of 1A at 18V Over Full Package Temperature Range; 100nA at 18V and +25oC * Noise Margin (Full Package Temperature Range) * 1V at VDD = 5V * 2V at VDD = 10V * 2.5V at VDD = 15V * Standardized Symmetrical Output Characteristics * 5V, 10V and 15V Parametric Ratings * Meets All Requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of B' Series CMOS Devices
Applications:
* Parallel Input/Serial Output Data Queueing * Parallel to Serial Data Conversion * General Purpose Register
Pinout
PI-8 1 Q6 2 Q8 3 PI-4 4 PI-3 5 PI-2 6 PI-1 7 VSS 8 16 VDD 15 PI-7 14 PI-6 13 PI-5 12 Q7 11 SERIAL IN
Functional Diagram
PAR. IN VDD 12345678 7 6 5 4 13 14 15 1 16
PARALLEL/SERIAL CONTROL SERIAL IN
9 11 10 2 12 3
10 CLOCK BUFFERED OUT 9 PARALLEL/SERIAL CONTROL CLOCK Q6 Q7 Q8
8 VSS
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 1999
File Number
3294
7-80
Specifications CD4014BMS, CD4021BMS
Absolute Maximum Ratings
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V (Voltage Referenced to VSS Terminals) Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .10mA Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC Package Types D, F, K, H Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265oC At Distance 1/16 1/32 Inch (1.59mm 0.79mm) from case for 10s Maximum
Reliability Information
Thermal Resistance . . . . . . . . . . . . . . . . ja jc Ceramic DIP and FRIT Package . . . . . 80oC/W 20oC/W Flatpack Package . . . . . . . . . . . . . . . . 70oC/W 20oC/W o Maximum Package Power Dissipation (PD) at +125 C For TA = -55oC to +100oC (Package Type D, F, K) . . . . . . 500mW For TA = +100oC to +125oC (Package Type D, F, K) . . . . . Derate Linearity at 12mW/oC to 200mW Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW For TA = Full Package Temperature Range (All Package Types) Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP A SUBGROUPS 1 2 VDD = 18V, VIN = VDD or GND Input Leakage Current IIL VIN = VDD or GND VDD = 20 3 1 2 VDD = 18V Input Leakage Current IIH VIN = VDD or GND VDD = 20 3 1 2 VDD = 18V Output Voltage Output Voltage Output Current (Sink) Output Current (Sink) Output Current (Sink) Output Current (Source) Output Current (Source) Output Current (Source) Output Current (Source) N Threshold Voltage P Threshold Voltage Functional VOL15 VOH15 IOL5 IOL10 IOL15 IOH5A IOH5B IOH10 IOH15 VNTH VPTH F VDD = 15V, No Load VDD = 15V, No Load (Note 3) VDD = 5V, VOUT = 0.4V VDD = 10V, VOUT = 0.5V VDD = 15V, VOUT = 1.5V VDD = 5V, VOUT = 4.6V VDD = 5V, VOUT = 2.5V VDD = 10V, VOUT = 9.5V VDD = 15V, VOUT = 13.5V VDD = 10V, ISS = -10A VSS = 0V, IDD = 10A VDD = 2.8V, VIN = VDD or GND VDD = 20V, VIN = VDD or GND VDD = 18V, VIN = VDD or GND VDD = 3V, VIN = VDD or GND Input Voltage Low (Note 2) Input Voltage High (Note 2) Input Voltage Low (Note 2) Input Voltage High (Note 2) VIL VIH VIL VIH VDD = 5V, VOH > 4.5V, VOL < 0.5V VDD = 5V, VOH > 4.5V, VOL < 0.5V VDD = 15V, VOH > 13.5V, VOL < 1.5V VDD = 15V, VOH > 13.5V, VOL < 1.5V 3 1, 2, 3 1, 2, 3 1 1 1 1 1 1 1 1 1 7 7 8A 8B 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 LIMITS TEMPERATURE +25
oC
PARAMETER Supply Current
SYMBOL IDD
CONDITIONS (NOTE 1) VDD = 20V, VIN = VDD or GND
MIN -100 -1000 -100 -
MAX 10 1000 10 100 1000 100 50 -0.53 -1.8 -1.4 -3.5 -0.7 2.8
UNITS A A A nA nA nA nA nA nA mV V mA mA mA mA mA mA mA V V V
+125oC -55oC +25o C
+125oC -55oC +25oC +125oC -55oC +25oC, +125oC, -55oC
+25oC, +125oC, -55oC 14.95 +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +125oC -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC 3.5 11 0.53 1.4 3.5 -2.8 0.7
VOH > VOL < VDD/2 VDD/2
1.5 4 -
V V V V
NOTES: 1. All voltages referenced to device GND, 100% testing being implemented. 2. Go/No Go test with limits applied to inputs.
3. For accuracy, voltage is measured differentially to VDD. Limit is 0.050V max.
7-81
Specifications CD4014BMS, CD4021BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP A SUBGROUPS TEMPERATURE 9 10, 11 VDD = 5V, VIN = VDD or GND 9 10, 11 VDD = 5V, VIN = VDD or GND 9 10, 11 +25oC +125oC, -55oC LIMITS MIN 3 2.22 MAX 320 432 200 270 UNITS ns ns ns ns MHz MHz
PARAMETER Propagation Delay
SYMBOL TPHL TPLH TTHL TTLH FCL
CONDITIONS (NOTE 1, 2) VDD = 5V, VIN = VDD or GND
Transition Time
+25oC +125oC, -55oC
Maximum Clock Input Frequency NOTES:
+25oC +125oC, -55oC
1. CL = 50pF, RL = 200K, Input TR, TF < 20ns. 2. -55oC and +125oC limits guaranteed, 100% testing being implemented. TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER Supply Current SYMBOL IDD CONDITIONS VDD = 5V, VIN = VDD or GND NOTES 1, 2 TEMPERATURE -55oC, +25oC +125oC VDD = 10V, VIN = VDD or GND 1, 2 -55oC, +25oC +125oC VDD = 15V, VIN = VDD or GND 1, 2 -55oC, +25oC +125oC Output Voltage Output Voltage Output Voltage Output Voltage Output Current (Sink) VOL VOL VOH VOH IOL5 VDD = 5V, No Load VDD = 10V, No Load VDD = 5V, No Load VDD = 10V, No Load VDD = 5V, VOUT = 0.4V 1, 2 1, 2 1, 2 1, 2 1, 2 +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +125oC -55oC Output Current (Sink) IOL10 VDD = 10V, VOUT = 0.5V 1, 2 +125oC -55oC Output Current (Sink) IOL15 VDD = 15V, VOUT = 1.5V 1, 2 +125oC -55oC Output Current (Source) IOH5A VDD = 5V, VOUT = 4.6V 1, 2 +125oC -55oC Output Current (Source) IOH5B VDD = 5V, VOUT = 2.5V 1, 2 +125oC -55oC Output Current (Source) IOH10 VDD = 10V, VOUT = 9.5V 1, 2 +125oC -55oC Output Current (Source) IOH15 VDD =15V, VOUT = 13.5V 1, 2 +125oC -55oC Input Voltage Low Input Voltage High VIL VIH VDD = 10V, VOH > 9V, VOL < 1V VDD = 10V, VOH > 9V, VOL < 1V 1, 2 1, 2 +25oC, +125oC, -55oC +25oC, +125oC, -55oC 7 V 4.95 9.95 0.36 0.64 0.9 1.6 2.4 4.2 50 -0.36 -0.64 -1.15 -2.0 -0.9 -1.6 -2.4 -4.2 3 mV V V mA mA mA mA mA mA mA mA mA mA mA mA mA mA V MIN MAX 5 150 10 300 10 600 50 UNITS A A A A A A mV
7-82
Specifications CD4014BMS, CD4021BMS
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) LIMITS PARAMETER Propagation Delay SYMBOL TPHL TPLH TTHL TTLH FCL CONDITIONS VDD = 10V VDD = 15V VDD = 10V VDD = 15V VDD = 10V VDD = 15V TRCL TFCL VDD = 5V VDD = 10V VDD = 15V Minimum Hold Time Serial In, Parallel In Parallel/Serial Control Minimum Clock Pulse Width TH VDD = 5V VDD = 10V VDD = 15V TW VDD = 5V VDD = 10V VDD = 15V Minimum Setup Time Serial Input (Ref. to CL) TS VDD = 5V VDD = 10V VDD = 15V Minimum Setup Time Parallel Inputs CD4014BMS (Ref. to CL) Minimum Setup Time Parallel Inputs CD4021BMS (Ref. to P/S) Minimum Setup Time Parallel/Serial Control CD4014BMS (Ref. to CL) Minimum P/S Pulse Width (CD4021BMS) TS VDD = 5V VDD = 10V VDD = 15V TS VDD = 5V VDD = 10V VDD = 15V TS VDD = 5V VDD = 10V VDD = 15V TWH VDD = 5V VDD = 10V VDD = 15V Minimum P/S Removal Time CD4021BMS (Ref. to CL) Input Capacitance NOTES: 1. All voltages referenced to device GND. 2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on initial design release and upon design changes which would affect these characteristics. 3. CL = 50pF, RL = 200K, Input TR, TF < 20ns. 4. If more than one unit is cascaded, TRCL should be made less than or equal to the sum of the transition time and the fixed propagation delay of the output of the driving stage for the estimated capacitive load. TREM VDD = 5V VDD = 10V VDD = 15V CIN Any Input NOTES 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 3, 5 3, 5 3, 5 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 2, 3 1, 2 TEMPERATURE +25oC +25 C +25oC +25
oC o
MIN 6 8.5 -
MAX 160 120 100 80 15 15 15 0 0 0 180 80 50 120 80 60 80 50 40 50 30 20 180 80 60 160 80 50 280 140 100 7.5
UNITS ns ns ns ns MHz MHz s s s ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF
Transition Time
Maximum Clock Input Frequency Clock Rise and Fall Time (Note 4)
+25oC +25oC +25oC +25o C +25oC +25
oC
+25oC +25 C +25o C +25oC +25oC +25
oC o
+25oC +25 C +25
oC o
+25oC +25
oC
+25oC +25oC +25oC +25oC +25oC +25oC +25
oC
+25oC +25oC +25oC +25oC +25oC +25oC
7-83
Specifications CD4014BMS, CD4021BMS
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER Supply Current N Threshold Voltage N Threshold Voltage Delta P Threshold Voltage P Threshold Voltage Delta Functional SYMBOL IDD VNTH VNTH VPTH VPTH F CONDITIONS VDD = 20V, VIN = VDD or GND VDD = 10V, ISS = -10A VDD = 10V, ISS = -10A VSS = 0V, IDD = 10A VSS = 0V, IDD = 10A VDD = 18V, VIN = VDD or GND VDD = 3V, VIN = VDD or GND Propagation Delay Time TPHL TPLH VDD = 5V 1, 2, 3, 4 +25oC NOTES 1, 4 1, 4 1, 4 1, 4 1, 4 1 TEMPERATURE +25oC +25oC +25oC +25oC +25oC +25oC MIN -2.8 0.2 VOH > VDD/2 MAX 25 -0.2 1 2.8 1 VOL < VDD/2 1.35 x +25oC Limit UNITS A V V V V V
ns
NOTES: 1. All voltages referenced to device GND. 2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
3. See Table 2 for +25oC limit. 4. Read and Record
TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25OC PARAMETER Supply Current - MSI-2 Output Current (Sink) Output Current (Source) SYMBOL IDD IOL5 IOH5A 1.0A 20% x Pre-Test Reading 20% x Pre-Test Reading DELTA LIMIT
TABLE 6. APPLICABLE SUBGROUPS CONFORMANCE GROUP Initial Test (Pre Burn-In) Interim Test 1 (Post Burn-In) Interim Test 2 (Post Burn-In) PDA (Note 1) Interim Test 3 (Post Burn-In) PDA (Note 1) Final Test Group A Group B Subgroup B-5 Subgroup B-6 Group D MIL-STD-883 METHOD 100% 5004 100% 5004 100% 5004 100% 5004 100% 5004 100% 5004 100% 5004 Sample 5005 Sample 5005 Sample 5005 Sample 5005 GROUP A SUBGROUPS 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9, Deltas 1, 7, 9 1, 7, 9, Deltas 2, 3, 8A, 8B, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas 1, 7, 9 1, 2, 3, 8A, 8B, 9 Subgroups 1, 2 3 Subgroups 1, 2, 3, 9, 10, 11 IDD, IOL5, IOH5A READ AND RECORD IDD, IOL5, IOH5A IDD, IOL5, IOH5A IDD, IOL5, IOH5A
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION MIL-STD-883 METHOD 5005 TEST PRE-IRRAD 1, 7, 9 POST-IRRAD Table 4 READ AND RECORD PRE-IRRAD 1, 9 POST-IRRAD Table 4
CONFORMANCE GROUPS Group E Subgroup 2
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS OSCILLATOR FUNCTION Static Burn-In 1 (Note 1) OPEN 2, 3, 12 GROUND 1,4-11, 13-15 VDD 16 9V -0.5V 50kHz 25kHz
7-84
Specifications CD4014BMS, CD4021BMS
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS (Continued) OSCILLATOR FUNCTION Static Burn-In 2 (Note 1) Dynamic Burn-In (Note 1) Irradiation (Note 2) NOTE: 1. Each pin except VDD and GND will have a series resistor of 10K 5%, VDD = 18V 0.5V 2. Each pin except VDD and GND will have a series resistor of 47K 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures, VDD = 10V 0.5V OPEN 2, 3, 12 2, 3, 12 GROUND 8 1, 4-9, 13 -15 8 VDD 1, 4-7, 9-11, 13-6 16 1, 4-7, 9-11, 13-16 2, 3, 12 10 11 9V -0.5V 50kHz 25kHz
Logic Diagram
P1 7 P2 P3 P4 P5 P6 P7 P8
*
6
*
5
*
4
*
13
*
14
*
15
*
1
*
SERIAL INPUT
* *
11
P D Q D
P Q D
P Q D
P Q D
P Q D
P Q D
P Q D
P Q
CLOCK 10 CL PS PARALLEL/SERIAL CONTROL CL PS CL PS CL PS CL PS CL PS CL PS CL PS
*
9 P C CL p n CL PS p D n CL VDD CL p n p n CL CL p Q n CL
p P D Q n
CL
CL
2 Q6
2 Q7
3 Q8
PS
CL
CL
*ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION NETWORK VSS
FIGURE 1. CD4014BM LOGIC DIAGRAM TRUTH TABLE - CD4014BMS CL SERIAL INPUT X X X X 0 1 X X = Don't Care Case PARALLEL/SERIAL CONTROL 1 1 1 1 0 0 X PI-1 0 1 0 1 X X X PI-n 0 0 1 1 X X X Q1 (INTERNAL) 0 1 0 1 0 1 Q1 Qn 0 0 1 1 Qn-1 Qn-1 Qn NC
NC = No Change
7-85
CD4014BMS, CD4021BMS
P1 7 P2 P3 P4 P5 P6 P7 P8
*
6
*
5
*
4
*
13
*
14
*
15
*
1
*
SERIAL INPUT
* *
11
P D Q D
P Q D
P Q D
P Q D
P Q D
P Q D
P Q D
P Q
CLOCK 10 CL PS CL PS CL PS CL PS CL PS CL PS CL PS CL PS
*
9 P
PARALLEL/ SERIAL CONTROL p n P D Q CL CL PS D n n p p
CL CL CL CL p Q n CL CL 2 Q6 2 Q7 3 Q8
CL
p n
p n
CL PS CL VDD CL
*ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION NETWORK VSS
FIGURE 2.
CD4021BMS LOGIC DIAGRAM
TRUTH TABLE - CD4021BMS SERIAL INPUT X X X X 0 1 X X = Don't Care Case PARALLEL/SERIAL CONTROL 1 1 1 1 0 0 0 Q1 (INTERNAL) 0 0 1 1 0 1 Q1
CL X X X X
PI-1 0 0 1 1 X X X
PI-n 0 1 0 1 X X X
Qn 0 1 0 1 Qn-1 Qn-1 Qn NC
7-86
CD4014BMS, CD4021BMA Typical Performance Characteristics
AMBIENT TEMPERATURE (TA) = +25oC AMBIENT TEMPERATURE (TA) = +25oC
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
30 25 20 15 10 5
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
15.0 GATE-TO-SOURCE VOLTAGE (VGS) = 15V 12.5 10.0 7.5 5.0 2.5 10V
10V
5V 0 5 10 15
5V 0 5 10 15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT CHARACTERISTICS
DRAIN-TO-SOURCE VOLTAGE (VDS) (V) -15 -10 -5 AMBIENT TEMPERATURE (TA) = +25oC GATE-TO-SOURCE VOLTAGE (VGS) = -5V
FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT CHARACTERISTICS
DRAIN-TO-SOURCE VOLTAGE (VDS) (V) -15 -10 -5 OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA) AMBIENT TEMPERATURE (TA) = +25oC GATE-TO-SOURCE VOLTAGE (VGS) = -5V -5
0
0 -5 -10 -15
0
0 OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA) 100
-10V
-20 -25
-10V
-10
-15V
-30
-15V
-15
FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS
FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS
PROPAGATION DELAY TIME (tTHL, tTLH) (ns)
AMBIENT TEMPERATURE (TA) = +25oC TRANSITION TIME (tTHL, tTLH) (ns)
AMBIENT TEMPERATURE (TA) = +25oC
300
200 SUPPLY VOLTAGE (VDD) = 5V
150
200
SUPPLY VOLTAGE (VDD) = 5V
100 10V 50 15V
10V 100 15V 0 0 20 40 60 CAPACITANCE (CL) (pF) 80
0 0
20
40 60 80 100 LOAD CAPACITANCE (CL) (pF)
FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF LOAD CAPACITANCE
FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A FUNCTION OF LOAD CAPACITANCE
7-87
CD4014BMS, CD4021BMS Typical Performance Characteristics
105
6 4 2
(Continued)
POWER DISSIPATION (PD) (W)
104
8 6 4 2
SUPPLY VOLTAGE (VDD) = 15V 10V 5V
10V
103
8 6 4 2
102
8 6 4 2
CL = 50pF CL = 15pF AMBIENT TEMPERATURE (TA) = +25oC
2 4 68
10 1 10 102 103 104 CLOCK INPUT FREQUENCY (fCL) (kHz)
2 4 68 2 4 68 2 4 68 2 4 68
105
FIGURE 9.
TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY
Chip Dimensions and Pad Layouts
Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch)
METALLIZATION: Thickness: 11kA - 14kA, PASSIVATION: 10.4kA - 15.6kA, Silane
AL.
BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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